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Wednesday, December 2, 2009

Via shrinks boards even further

Mobile-ITX unveiled
By Ian Williams Tuesday,1 December 2009

VIA TECHNOLOGIES has taken the wraps off its smallest PC board form factor yet, the Mobile-ITX, which is 50 per cent smaller than its predecessor the Pico-ITX. Running with the growing trend toward mobile devices, Via developed the Mobile-ITX open form factor specification for ultra-compact and portable embedded devices. The 6cm x 6cm computer-on-module specification bundles in a core CPU, chipset and memory functionality and I/O that includes the CRT, DVP and TTL display support, HD Audio, IDE and USB 2.0, as well as PCI Express, SMBus, GPIO, LPC, SDIO and PS2 signals, through customisable baseboards. According to Via, Mobile-ITX-based systems consume as little as five Watts and are a modularised design split between a CPU module card and an I/O carrier board. "With Mobile-ITX we have again pushed back the barriers that limit just how small an embedded industrial PC can be," said Daniel Wu, vice president of the Embedded Platform Division at Via.

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